Integration technologies for 2D materials ieee techrxiv
➤ Gửi thông báo lỗi ⚠️ Báo cáo tài liệu vi phạmNội dung chi tiết: Integration technologies for 2D materials ieee techrxiv
Integration technologies for 2D materials ieee techrxiv
TEchRxJyPowered by IEEEFabrication techniques for the integration of 2D materialsThis paper was downloaded from TechRxiv (https://www.techrxiv.org).LI Integration technologies for 2D materials ieee techrxivICENSEcc BY 4.0SUBMISSION DATE / POSTED DATE17-11-2021 /19-11-2021CITATIONMoss, David (2021): Fabrication techniques for the integration of 2D materials TechRxiv. Preprint.https://doi.org/10.36227/techrxiv.17035937.v1DOI10.36227/techrxiv,17035937,v1Fabrication techniques for the integration of 2D ma Integration technologies for 2D materials ieee techrxivterialsLinnan Jia1, Jiayang Wu1’*, Yuning Zhang1, Yang Qu1, Baohua Jicr, zhigang Chen31, and David J. Moss1*’Optical Sciences Centre. Swinburne UniverIntegration technologies for 2D materials ieee techrxiv
sity of Technolog}-. Hawthorn. VIC 3122. Australia-Centre for Translational Atoinaterials. Swinburne University of Technology. Haulhorn. VIC 3122. AusTEchRxJyPowered by IEEEFabrication techniques for the integration of 2D materialsThis paper was downloaded from TechRxiv (https://www.techrxiv.org).LI Integration technologies for 2D materials ieee techrxiv China‘Department of Physics and Astronomy. San Francisco State University. San Francisco. CA 94132. USA •*E-mail: ỉiavmigivu(ậswiit. edttơu, dìHộsyĩị win edit ailKeywords: 2D materials, integrated devices, fabrication techniques, heterostructures.AbstractWith compact footprint, low energy consumpti Integration technologies for 2D materials ieee techrxivon, high scalability, and mass producibility. chip-scale integrated devices are an indispensable part of modern technological change and development.Integration technologies for 2D materials ieee techrxiv
Recent advances in two-dimensional (2D) layered materials with their unique structures and distinctive properties have motivated their on-chip integraTEchRxJyPowered by IEEEFabrication techniques for the integration of 2D materialsThis paper was downloaded from TechRxiv (https://www.techrxiv.org).LI Integration technologies for 2D materials ieee techrxivt requires a diverse range of device fabrication techniques, which are of fundamental importance to achieve good performance and high reproducibility. This paper reviews the state-of-art fabrication techniques for the on-chip integration of 2D materials. First, an overview of the material properties Integration technologies for 2D materials ieee techrxiv and on-chip applications of 2D materials is provided. Second, different approaches used for integrating 2D materials on chips are comprehensively revIntegration technologies for 2D materials ieee techrxiv
iewed, which are categorized into material synthesis, on-chip transfer, film patterning, and property tuning / modification. Third, the methods for inTEchRxJyPowered by IEEEFabrication techniques for the integration of 2D materialsThis paper was downloaded from TechRxiv (https://www.techrxiv.org).LI Integration technologies for 2D materials ieee techrxiv.1. IntroductionThe integrated circuits industry (both electronic and photonic) is fundamental to our information age. Chip-scale integrated devices, featuring compact footprint, low energy consumption, and low cost enabled by large-scale manufacturing, have had a profound influence on our modern li Integration technologies for 2D materials ieee techrxivfe. Although complementary’ metal-oxide-semiconductor (CMOS) compatible material platforms, such as silicon, silicon nitride, and silica, have dominatIntegration technologies for 2D materials ieee techrxiv
ed integrated devices, they suffer from limitations intrinsically arising from their material properties, creating challenges for them to meet the eveTEchRxJyPowered by IEEEFabrication techniques for the integration of 2D materialsThis paper was downloaded from TechRxiv (https://www.techrxiv.org).LI Integration technologies for 2D materials ieee techrxivvercome these challenges. For example, integrated spintronic transistors have been realized by integrating europium monoxide (EuO) ferromagnetic films to inject spin-polarized earners into silicon/41 In addition, the integration of organic polymers onto silicon photonic chips has greatly increased t Integration technologies for 2D materials ieee techrxivheir processing speed and functionality, which were otherw ise limited by the slow free carrier response/51Since the ground-breaking discovery' of graIntegration technologies for 2D materials ieee techrxiv
phene in 2004/*1 2D layered materials have attracted tremendous interest, with the material family growing rapidly to include graphene oxide (GO), traTEchRxJyPowered by IEEEFabrication techniques for the integration of 2D materialsThis paper was downloaded from TechRxiv (https://www.techrxiv.org).LI Integration technologies for 2D materials ieee techrxiv2D counterparts exhibit many extraordinary properties, such as ultra-high carrier mobility, layerdependent bandgaps, high anisotropy, broadband and low optical dispersion, and excellent nonlinear optical responses/8"131 In addition, due to the weak out-of-plane van der Waals interactions. 2D materia Integration technologies for 2D materials ieee techrxivls possess surfaces that are free of dangling bonds, thus enabling them to be readily integrated onto chips without stress or restrictions due to lattIntegration technologies for 2D materials ieee techrxiv
ice mismatch/14,151 Their atomically thin geometry is also advantageous for high-density integration and low-power operation. Together with their highTEchRxJyPowered by IEEEFabrication techniques for the integration of 2D materialsThis paper was downloaded from TechRxiv (https://www.techrxiv.org).LI Integration technologies for 2D materials ieee techrxivformance beyond what the conventional integrated platforms can possibly oiler.GOBPMXenesFigure 1. Illustration of typical 2D layered materials for on-chip integration. h-BN: hexagonal boron nitride. TMDCs: transition metal dichalcogenides. GO: graphene oxide. BP: black phosphorus. MOFs: metal-organi Integration technologies for 2D materials ieee techrxivc frameworks.MOFsPerovskitesThe incorporation of 2D materials onto conventional integrated circuits combines the best of both worlds (Fig. 1). In theIntegration technologies for 2D materials ieee techrxiv
past decade, there has been significant progress in hybrid integrated devices incorporating 2D materials for a variety of applications such as field-eTEchRxJyPowered by IEEEFabrication techniques for the integration of 2D materialsThis paper was downloaded from TechRxiv (https://www.techrxiv.org).LI Integration technologies for 2D materials ieee techrxivonlinear optical devices.!25*291 and sensors.!30'*21 The success of these devices has relied heavily on developing advanced integration fabrication techniques - from material synthesis to on-chip transfer, film patterning, and property tuning / modification. While 2D materials have been the subject Integration technologies for 2D materials ieee techrxivof many previous reviews,!14,33*3<5]these have predominantly focused on either the material aspects of 2D films or the specificapplications, rather thIntegration technologies for 2D materials ieee techrxiv
an the fabrication techniques. Here, we focus on the latter - review comprehensively the diverse methods used to fabricate chip-scale integrated devicTEchRxJyPowered by IEEEFabrication techniques for the integration of 2D materialsThis paper was downloaded from TechRxiv (https://www.techrxiv.org).LITEchRxJyPowered by IEEEFabrication techniques for the integration of 2D materialsThis paper was downloaded from TechRxiv (https://www.techrxiv.org).LIGọi ngay
Chat zalo
Facebook